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HS Inc. group develop and supply the best products and solutions for Semiconductor / MEMS, FPD(LCD, OLED), LED, Solar Industries. And HSM VINA is the specialized company in the LCD, OLED industries. And HSM VINA is specialized in PI (Polyimide) Electrostatic Chuck technology field.

PI Electrostatic Chuck technology is a type of electrostatic chuck used in semiconductor manufacturing and other precision applications. An electrostatic chuck is a device that securely holds and immobilizes a substrate during various processes, such as etching, deposition, and lithography, within a vacuum chamber.

The working principle of a PI Electrostatic Chuck involves the generation of an electrostatic force between the chuck and the substrate. The chuck is electrically biased by applying a direct current (DC) voltage to the conductive layer. When the voltage is applied, an electric field is created between the chuck and the substrate, resulting in an electrostatic attraction force.

The key advantages of PI Electrostatic Chucks are as follows:

High holding force: The electrostatic attraction force generated by the chuck is typically higher than other mechanical chucking methods, allowing for secure immobilization of the substrate. This is crucial during high-speed processes or when dealing with thin or delicate substrates.

Uniform clamping: The electrostatic force is distributed evenly across the chuck's surface, resulting in uniform clamping of the substrate. This ensures consistent contact and minimizes the risk of warping or distortion.

Temperature control: PI Electrostatic Chucks can provide excellent temperature control. By adjusting the applied voltage, the chuck can heat or cool the substrate, maintaining a stable temperature during processing. This feature is particularly important for temperature-sensitive materials or processes.

Non-contact operation: Unlike mechanical chucks that use clamps or vacuum suction, PI Electrostatic Chucks operate without physical contact with the substrate. This eliminates the risk of mechanical damage, contamination, or particle generation, enhancing yield and reliability.

Compatibility: PI Electrostatic Chucks are compatible with various substrate materials, including silicon wafers, glass substrates, and flexible films. They can accommodate different sizes and shapes, making them versatile for different manufacturing processes.

Overall, PI Electrostatic Chuck technology offers precise and reliable substrate clamping in semiconductor manufacturing and other precision applications, contributing to improved process control and product quality.